ExaNoDe has developed an integrated prototype deploying technology building blocks designed to contribute to the EU drive towards exascale computing. It employs a low-power architecture and advanced nanotechnologies to realise high-performance, high-density computing.
The heterogeneous Multi-Chip-Module (MCM) builds on the following key components:
- ARM-v8 computing architecture;
- 3-D integration (interposer) of System-on-Chips (SoC) for higher compute density combined with high-bandwidth, low-latency data communication interfaces;
- UNIMEM-based advanced memory schemes for high scalability
More information can be found int the general and technical press releases.
Picture above: Single ExaNoDe Multi-chip module (MCM) with FPGAs, interposer and chiplet